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Iflytek and other robot technology companies have a registered capital of 30 million yuan. According to Tianyancha App, Anhui Lingdong General Robot Technology Co., Ltd. was recently established with Hu Guoping as the legal representative and a registered capital of 30 million yuan. Its business scope includes industrial robot manufacturing, industrial robot sales, intelligent robot research and development, electrical equipment sales, computer software and hardware and auxiliary equipment retail, information system integration services, intelligent robot sales, mechanical equipment leasing, etc. According to shareholder information, the company is jointly held by Anhui Xunfei Yunchuang Technology Co., Ltd., a subsidiary of Iflytek (002230), Anhui Yanzhi Technology Co., Ltd. and Anhui Lingji Wanwu Technology Partnership (Limited Partnership).The dividend index has performed better for a long time, and the allocation value of Standard & Poor's dividend ETF(562060) has attracted much attention. By midday on December 12, the standard & poor's dividend ETF(562060) had increased by 0.44%, with a turnover of 10.1606 million yuan. The constituent stocks are mixed. In terms of rising, Yongxing Materials led the gains, and Voice Holdings followed suit. In terms of decline, Luan Huan was able to lead the decline, while Orchid Science and Technology fell. In the news, as of December 11, 940 listed companies have thrown out 994 single and medium-term cash dividend plans this year, with a year-on-year increase of 269.41%; The total amount of dividends involved was 667.519 billion yuan, a year-on-year increase of 166.24%. According to the analysis of Xingzheng Securities, the long-term performance of dividend strategy in the US stock market is significantly better than that of the S&P 500 index, and its stability is higher. From 2003 to 2022, the annualized rate of return of the S&P 500 high-quality and high-dividend index reached 12.0%, which was higher than the S&P 500 index's 10.5%. Donghai securities said that under the downward trend of risk-free interest rate, dividend stability and growth potential have become important considerations, and we are optimistic about the investment value of dividend plate.China Green Power: Obtained the 200,000 kW wind power construction index in Guizhou. China Green Power announced that on December 10, 2024, the projects of "Pingshan Wind Farm in duyun city" and "Tudizhai Wind Farm in duyun city" declared by Shaanxi Branch of Luneng New Energy Co., Ltd., which belongs to the company, were included in the "Guizhou Province 2024 Wind Power Photovoltaic Power Generation Construction Scale Project Plan". Duyun city Pingshan wind farm project has an installed capacity of 100,000 kilowatts, and duyun city Tudizhai wind farm project has an installed capacity of 100,000 kilowatts. The acquisition of the above-mentioned new energy construction indicators is conducive to further enriching the company's new energy project reserves, enhancing the company's sustainable development capability, and boosting the realization of the annual double "two thousand" goals and the "14 th Five-Year Plan" development plan.

At the close of early trading, the main contracts of domestic futures rose more and fell less. Fuel oil rose by nearly 4%, coke, Shanghai nickel, low sulfur fuel oil (LU), SC crude oil and coking coal rose by over 2%, and glass, sugar, liquefied petroleum gas (LPG) and alumina rose by over 1%. In terms of decline, the European line of container transportation fell by more than 2%, and pigs fell by more than 1%.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)Thailand's consumer confidence index rose to 56.9 in November, boosted by stimulus measures, and Thailand's consumer confidence index rose from 56.0 to 56.9 in November.

Thai Prime Minister: Will build houses for low-income people; The government will provide soft loans for community enterprises.Zuckerberg is reported to have donated $1 million to Trump's inauguration fund. Zuckerberg's donation is the latest move to strengthen relations with Trump.Mizuho listed in Japan to invest in the ETF of Saudi stock market.